HI-FILL BOND

Shipping policy

your order will be arrived within 2 – 5 days after confirming it.

Return Policy

you could return the products within 2 days after arrival, in condition of no change of quality or package of the product.

Price range: 250,00 EGP through 550,00 EGP

Additional information

size

2 ml, 5 ml
HI-FILL BOND

Product Details

ONE COMPONENT LIGHT CURED ADHESIVE

The 7th generation one-component bond system is a self-etch  bonding  system  in  dentistry  in  which  both pickling  and  primary  and  bonding  agents  are combined. These systems provide effective bonding to  both  dentin  and  enamel  and  offer  ease  of application and time savings. It is suitable for use in selective etch (roughening only tooth  enamel  with  phosphoric  acid)  and  total  etch (roughening  on  both  enamel  and  dentin  with phosphoric acid) procedures. It is a universal bonding agent  that  polymerizes  with  radiation  with  ideal adhesion and adhesion strength.

FEATURES & BENEFITS

  • Easy and Fast  Application:  Since  it  is  a  single

component, it shortens the application time.• Minimal  Technical  Precision:  Humidity  control

PACKAGING

5 ml. BOTTLE

2 ml. BOTTLE

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